WaferBond `09

The Conference on Wafer Bonding for Microsystem, 3D- and Wafer Level Integration was held in Grenoble /France in Pre-Christmas Time 2009.

It was organized by CEA-Leti at the Maison des Micro et Nanotechnologies MINATEC.

Nearly 100 Attendees joined this Wafer Bonding Event.

WaferBond 09 started with an Evening Reception on December the 6th 2009.

The Conference itself was opened at Monday the 7th by

Technical Chair Roy Knechtel and Lea Di Cioccio, who has done an excellent Organization of the Conference together with Hubert Moriceau.

Hubert itself followed directly with the first Keynote about Fundamentals and New Approaches.

The different Conference Sessions were characterized by interesting presentations ...

and and an always well filled auditorium.

35 talks were given and 12 Posters are shown during lunch time of both days.

At the end of first Conference Day there was a Magic Social Event at the Bastllie de Grenoble wich was reached by the Cable Car.

Also the second days was well filled with interesting presentations and a lot of discussions and contacts.

The Conference ended at the late afternoon with a short summery, the thanks to organizers, sponsors and exhibitors...

...and the outlook on the next event which will be hosted by

Fraunhofer ENAS Chemnitz/Germany in Fall 2011.

December 2009

Roy Knechtel

Technical Chair

roy.knechtel@xfab.com