Technical Topics
  • Metrology for Wafer Bonding processes and bonded wafer stacks
  • Wafer Bonding in Industrial Processes: Processes Stability and Reliability
  • Metal based Wafer Bonding Technologies
  • Temporary Wafer Bonding for Wafer Thinning and Thin Wafer Handling
  • System Integration by Wafer Bonding
  • Enabling new Technologies and Devices for modern Applications by Wafer Bonding
  • Wafer Bonding for Electronics and Multisystem Integration
  • The future of Wafer Bonding, fundamental investigations and new approaches