In recent years, more than 100 attendees (half of them from industry) from over 15 countries took part in the WaferBond conference. So the audience will be expected to be high level experts in the field of bonding technologies. Workshops are being held biannually at different locations in Europe. More than 30 oral and 15 poster presentations were given then. The contributions (short papers and presentations) are being published in proceedings as well as electronically.
In 2019 the “International Conference on Wafer Bonding – WaferBond ´19” will take place in Halle, Germany organized by Fraunhofer IMWS on 2nd – 4th December 2019.
The conference will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications and will address as well quality and reliability issues. It is planned to invite 3-4 keynote speakers.